multilayer ceramic chip capacitors 1 of 3 creation date : april 20, 2017 (gmt) c1608c0g1h1r5c080aa tdk item description c1608c0g1h1r5ct**** applications commercial grade please refer to part no. cga3e2c0g1h1r5c080aa for automotive use. feature general general (up to 50v) series c1608 [eia 0603] status production (not recommended for new design) size length(l) 1.60mm 0.10mm width(w) 0.80mm 0.10mm thickness(t) 0.80mm 0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 1.5pf 0.25pf rated voltage 50vdc temperature characteristic c0g(030ppm/c) q (min.) 430 insulation resistance (min.) 10000m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : april 20, 2017 (gmt) c1608c0g1h1r5c080aa characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c1608c0g1h1r5c080aa esr c1608c0g1h1r5c080aa capacitance c1608c0g1h1r5c080aa dc bias characteristic c1608c0g1h1r5c080aa temperature characteristic c1608c0g1h1r5c080aa(no bias) c1608c0g1h1r5c080aa(dc bias = 25v ) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : april 20, 2017 (gmt) c1608c0g1h1r5c080aa associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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